The heat generated by the CPU/Flash chip on the mainboard PCB of the smartphone is evenly transferred to the metal steel bracket and frame in the middle through the graphite film.
At this time, the heat of the CPU high-heating chip is quickly averaged to the entire graphite plane. The heat of the chip is transferred to the large graphite film on the surface of the steel support at the same time, and the heat can be fully and evenly dispersed in the plane, eliminating local hot spots, so that the chip can be in a suitable working temperature range, and the performance can be maximized. The heat in the mobile phone is redistributed through the high thermal conductivity graphite film, and the heat is dissipated effectively through the mobile phone shell and large-area touch screen, and the heat is evenly transferred to the outside of the mobile phone through the maximized surface area of the low-conductivity case. The uniform temperature characteristics of the graphite film can eliminate the local overheating of the chip and solve the discomfort caused by the high temperature for a long time.

The steel support graphite film on the back of the battery compartment also undertakes the function of equalizing the temperature of the touch screen and dissipating heat from the battery, eliminating the need for battery compartment after a long phone call.
A hot problem. The heat of the smartphone will be assisted in cooling through the LCD touch screen and the back cover of the phone. The conductivity of the graphite heat dissipation film can be used to control the heat generation at a suitable temperature acceptable to the human body. We can say that smartphones use graphite heat dissipation film, plane heat uniformity, and heat conduction to quickly and evenly transfer heat to the casing, frame, screen and other components, thereby obtaining a larger effective heat dissipation area. A lot of heat is transferred to the outside of the phone!
The graphite heat dissipation film is directly attached to the metal shield of the motherboard, and the shield under the graphite heat dissipation film protects the core chips such as the CPU processor Qualcomm MSM8260 with high heat generation, which can have dual effects of heat dissipation and shielding.

Smartphone adopts Qualcomm's third-generation Snapdragon MSM8260 processor, dual 1.5GHz processor core, adopts 45nm process, can support high-level network applications and multimedia performance, and has 3D/2D acceleration that supports OpenGLES 2.0 and pen VG 1.1 acceleration Engine's powerful graphics processor, 1080p video encoding/decoding, dedicated low-power audio alarm, and integrated low-power GPS. HTC Sensation uses this processor, becoming the first batch of dual-core processors with Texas Instruments OMAP4430, Nvidia Tera 2, Samsung Exynos 4210 (Orion)
Qualcomm MSM8260 mobile phone chip will bring 1080p high-definition video application popularization to smart phones, and can meet the increasingly high performance requirements of multi-tasking processing, 3D games, etc., so that the processing capabilities of smart phones and other portable electronic products will be further improved promote. The core power consumption of the 1.5GHz Scropion will reach 650mW. The powerful functions also bring a large amount of heat. The graphite heat dissipation film can improve the overall heat dissipation effect of the mobile phone to a certain extent, disperse the heat away, and keep the temperature of the mobile phone. decline!

The graphite heat sink of the smart phone disperses the heat concentrated on the screen in the heat source and transfers the heat to the metal plate attached to the steel frame in the middle, shielding the diffused battery and the case, forming a larger effective heat dissipation area , forming an effective heat dissipation path.

The heat generated by the CPU/Flash chip on the mainboard PCB of the smartphone is evenly transferred to the metal steel bracket and frame in the middle through the graphite film.
At this time, the heat of the CPU high-heating chip is quickly averaged to the entire graphite plane. The heat of the chip is transferred to the large graphite film on the surface of the steel support at the same time, and the heat can be fully and evenly dispersed in the plane, eliminating local hot spots, so that the chip can be in a suitable working temperature range, and the performance can be maximized. The heat in the mobile phone is redistributed through the high thermal conductivity graphite film, and the heat is dissipated effectively through the mobile phone shell and large-area touch screen, and the heat is evenly transferred to the outside of the mobile phone through the maximized surface area of the low-conductivity case. The uniform temperature characteristics of the graphite film can eliminate the local overheating of the chip and solve the discomfort caused by the high temperature for a long time.

The graphite film on the steel support of the touch screen back panel of the smartphone mainly distributes heat evenly on the touch screen and the steel support of the middle frame, avoiding local hot spots and insensitive touch when the touch screen exceeds 41 degrees Celsius.

Mobile phone front PCB graphite heat dissipation film application
Smartphone PCB shielding graphite film is mainly to spread the heat in the PCB motherboard, to avoid local hot spots and avoid the chip over the operating temperature range to avoid the crash of the situation

Application of graphite heat dissipation film for mobile phone backshell
The heat dissipation of the battery has been taken into consideration. A graphite heat sink is attached to the back cover close to the battery to dissipate heat to one side, preventing the local temperature of the potassium battery from getting too high.